It appears you have JavaScript disabled within your browser. Some functions on this page will not work unless you log in.

See an Error?

ATS-KRP-3561-C1-R0

Images are for reference only
See Product Specifications

Mouser No:

984-ATS-KRP-3561C1R1

Mfr. No:

ATS-KRP-3561-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x9.76mm

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

ATS-KRP-3561-C1-R0 Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

More Information

Learn more about Advanced Thermal Solutions ATS-KRP-3561-C1-R0

Delivery Restriction:

Mouser does not presently sell this product in your region.

Availability

Stock:: An unexpected error occurred. Please try again later.

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
Delivery Restriction:	Mouser does not presently sell this product in your region.
RoHS:
Brand:	Advanced Thermal Solutions
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Packaging:	Tray
Product Type:	Heat Sinks
Series:	ATS-KR
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	AMD Xilinx Kria/maxiFLOW
Unit Weight:	34 g

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

This functionality requires JavaScript to be enabled.

CAHTS:: 8473309000
USHTS:: 8473305100
JPHTS:: 847330090
MXHTS:: 8473300499
ECCN:: EAR99

Heat Sinks for AMD Kria™ K26 SOMs

Advanced Thermal Solutions Heat Sinks for AMD Kria™ K26 SOMs are designed to fit the K26 System-On-Module (SOM). These heatsinks are engineered to mount seamlessly to the K26 SOM’s standard heat spreader plate. These heat sinks include high-performance Thermal Interface Material (TIM) and necessary hardware and maximize heat dissipation to keep the device below critical thermal thresholds. These modules are used with AMD’s two starter kits (Robotics and Vision AI). Typical applications include robotics, industrial communications and control, retail analytics, security, smart cameras, and machine vision.