2512066017Y0

Fair-Rite
623-2512066017Y0
2512066017Y0

Mfr.:

Description:
Ferrite Beads MultLyr Chip Bead 600 OHM 1206 350mA

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Learn more about Fair-Rite 2512066017Y0

In Stock: 2.158

Stock:
2.158
Can Dispatch Immediately
On Order:
37.550
Factory Lead Time:
20
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 3000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
0,181 € 0,18 €
0,118 € 1,18 €
0,103 € 2,58 €
0,092 € 4,60 €
0,083 € 8,30 €
0,071 € 17,75 €
0,063 € 31,50 €
0,049 € 49,00 €
Full Reel (Order in multiples of 3000)
0,04 € 120,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Fair-Rite
Product Category: Ferrite Beads
RoHS:  
25
Ferrite Chip Beads
SMD/SMT
1206 (3216 metric)
600 Ohms
350 mA
25 %
250 mOhms
- 55 C
+ 125 C
3.2 mm
1.6 mm
1.1 mm
Reel
Cut Tape
MouseReel
Brand: Fair-Rite
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Product Type: Ferrite Beads
Factory Pack Quantity: 3000
Subcategory: Ferrites
Test Frequency: 100 MHz
Type: Multilayer Ferrite Chip Bead
Unit Weight: 10 mg
Products found:
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Attributes selected: 0

TARIC:
8504509590
CNHTS:
8548000001
CAHTS:
8548000000
USHTS:
8548000000
JPHTS:
854800000
KRHTS:
8504509090
MXHTS:
8504509102
BRHTS:
85045000
ECCN:
EAR99

Series 25 Multilayer Chip Beads

Fair-Rite Series 25 Multilayer Chip Beads include a broad selection of cost-effective multilayer chip beads to suppress conducted EMI signals. The chip beads are available in standard, high, and GHz signal speeds. These chips are stored and operated at a temperature range of -55°C to +125°C. Fair-Rite Multilayer Chip Beads can be ideally used in devices such as cellular phones, computers, laptops, and pagers. These small package sizes accommodate automated placements and allow for a dense packaging of circuit boards.

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