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171224-2011

Name: Molex 171224-2011
Brand: Molex
SKU: 538-171224-2011
Price: 70.64 EUR
Availability: InStock

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Mouser No:

538-171224-2011

Mfr. No:

171224-2011

Mfr.:

Molex

Description:

I/O Connectors zSFP+ Stacked, 2X2 W/Metal, w/ 4 LP

Datasheet:

171224-2011 Datasheet

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Learn more about Molex 171224-2011

In Stock: 61

Stock:: 61 Can Dispatch Immediately

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Factory Lead Time:: 13 Weeks Estimated factory production time for quantities greater than shown.

Quantities greater than 61 will be subject to minimum order requirements.

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Unit Price:

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Ext. Price:

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Est. Tariff:

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	70,64 €	70,64 €
	63,00 €	630,00 €
	60,57 €	1.514,25 €
	58,55 €	2.927,50 €
	55,32 €	3.983,04 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	I/O Connectors
RoHS:
Product:	Receptacles
Gender:	Jack (Female)
Number of Positions:	80 Position
Pitch:	0.8 mm
Voltage Rating:	30 VAC
Contact Plating:	Gold
Mounting Style:	Panel Mount
Termination Style:	Through Hole
Mounting Angle:	Right Angle
Series:	171224
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Brand:	Molex
Color:	Black
Contact Material:	Copper Alloy
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	ID
Current Rating:	500 mA
Features:	Stacked Ganged Assembly with Metal Spring Fingers, with 4 light pipes
Flammability Rating:	UL 94 V-0
Housing Material:	Thermoplastic (TP)
Number of Ports:	4 Port
Product Type:	I/O Connectors
Factory Pack Quantity:	72
Subcategory:	I/O Connectors
Unit Weight:	51,084 g

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Datasheet

171224-2011 Datasheet

Application Notes

Application Specification (PDF)

Models

Specification Sheets

Technical Resources

Drawing (PDF)

RoHS Certificate (PDF)

TARIC:: 8536693000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
BRHTS:: 85366990
ECCN:: EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

zSFP+ Interconnect Solution

Molex zSFP+™ Interconnect Solution delivers unparalleled signal integrity with superior EMI protection for next-generation Ethernet and Fibre Channel applications. The innovative design provides excellent thermal management without adding unnecessary materials or costs. The zSFP+ Interconnect Solution features a stacked design that delivers maximum thermal efficiency while providing excellent signal integrity and Electromagnetic Interference (EMI) protection. Both an enhanced airflow version for applications that require light pipes and a thru-flow design which opens up the midsection to take advantage of front-to-back airflow are available. This design allows heat to be dissipated without the need for heat sink components or other complex and costly materials. The Molex zSFP+ is ideal for applications requiring 25Gbps data rates for next-generation Ethernet and Fibre Channel applications. The system provides a drop-in replacement for existing zSFP designs (re-routing of thru-flow design may be necessary if light pipes are in the midesction).