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87758-4017

Name: Molex 87758-4017
Brand: Molex
SKU: 538-87758-4017
Price: 2.87 EUR
Availability: InStock

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Mouser No:

538-87758-4017

Mfr. No:

87758-4017

Mfr.:

Molex

Description:

Headers & Wire Housings MGrid VHdr .76AuLF 4 d VHdr .76AuLF 40Ckt

Datasheet:

87758-4017 Datasheet

ECAD Model:

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In Stock: 764

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	2,87 €	2,87 €
	2,61 €	26,10 €
	2,48 €	62,00 €
	2,30 €	230,00 €
	2,01 €	502,50 €
	1,96 €	980,00 €
	1,76 €	1.584,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Headers & Wire Housings
RoHS:
Product:	Headers
Type:	Breakaway
Number of Positions:	40 Position
Pitch:	2 mm (0.079 in)
Number of Rows:	2 Row
Row Spacing:	2 mm (0.079 in)
Mounting Style:	Through Hole
Termination Style:	Solder Pin
Mounting Angle:	Straight
Contact Gender:	Pin (Male)
Contact Plating:	Gold
Mating Post Length:	4 mm (0.157 in)
Termination Post Length:	2.6 mm (0.102 in)
Series:	87758
Tradename:	Milli-Grid
Application:	Board-to-Board, Signal
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 105 C
Packaging:	Tray
Brand:	Molex
Contact Material:	Tin
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	ID
Current Rating:	2 A
Flammability Rating:	UL 94 V-0
Housing Material:	Nylon
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	900
Subcategory:	Headers & Wire Housings
Voltage Rating:	125 V
Part # Aliases:	0877584017
Unit Weight:	826 mg

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Datasheet

87758-4017 Datasheet

Models

RoHS Certificate (PDF)

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

MolexFamMilliGrid

Miniaturization Solutions

Molex Miniaturization Solutions are ideal for a vast array of applications such as automotive, smart devices, mobile devices, and medical technology. These connectors provide space savings, high-density signals, and durability. The miniaturization of Molex connectors offers the benefit of fitting more components into smaller spaces, leading to increased functionality without the increased size or weight.