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STGAP2SICSAC

Name: STMicroelectronics STGAP2SICSAC
Brand: STMicroelectronics
SKU: 511-STGAP2SICSAC
Price: 3.23 EUR
Availability: OutOfStock

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Mouser No:

511-STGAP2SICSAC

Mfr. No:

STGAP2SICSAC

Mfr.:

STMicroelectronics

Description:

Galvanically Isolated Gate Drivers Galvanically isolated 4 A single gate driver for SiC MOSFETs

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Datasheet:

STGAP2SICSAC Datasheet (PDF)

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Availability

Stock:: Non-Stocked

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Factory Lead Time:: 25 Weeks Estimated factory production time.

Long lead time reported on this product.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	3,23 €	3,23 €
	2,18 €	21,80 €
	2,02 €	50,50 €
	1,76 €	176,00 €
	1,65 €	412,50 €
	1,18 €	590,00 €
	1,17 €	936,00 €
	1,14 €	2.736,00 €
	1,12 €	6.272,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	STMicroelectronics
Product Category:	Galvanically Isolated Gate Drivers
RoHS:
Isolation Voltage:	5 kV
Qualification:	AEC-Q100
Packaging:	Tube
Brand:	STMicroelectronics
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	TW
Moisture Sensitive:	Yes
Product Type:	Gate Drivers
Factory Pack Quantity:	800
Subcategory:	PMIC - Power Management ICs

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Datasheet

STGAP2SICSAC Datasheet (PDF)

PCN

Product Change Notification 2025-2-4 (PDF)

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CAHTS:: 8542390000
USHTS:: 8542390090
MXHTS:: 8542399999
ECCN:: EAR99

STGAP2SICS Single Gate Drivers

STMicroelectronics STGAP2SICS Single Gate Drivers provide galvanic isolation between the gate driving channel, low voltage control, and interface circuitry. The gate drivers are characterized by 4A capability and rail-to-rail outputs, making the devices suitable for mid and high-power applications such as power conversion and motor driver inverters in industrial applications. The device is available in two different configurations. The configuration with separated output pins (STGAP2SICSTR) allows users to optimize turn-on and turn-off using dedicated gate resistors independently. The configuration featuring a single output pin and Miller CLAMP function (STGAP2SICSCTR) prevents gate spikes during fast commutations in half-bridge topologies. Both configurations provide high flexibility and a bill of material reduction for external components.