10175353-1631LF

Amphenol FCI
649-10175353-1631LF
10175353-1631LF

Mfr.:

Description:
Power to the Board MinitekPwr 3.0 BMI HCC, Dual Row, Right Angle Through Hole Header, 30in gold plate on contact area, tin plate on solder tail, Black Color, 14 Positions

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 1500   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
3,21 € 4.815,00 €
3,04 € 7.600,00 €

Product Attribute Attribute Value Select Attribute
Amphenol
Product Category: Power to the Board
RoHS:  
Power to the Board
Pin (Male)
12 A
600 VAC
16 Position
Through Hole
Solder Pin
3 mm
MinitekPwr 3.0
Minitek
Brand: Amphenol FCI
Contact Material: Copper
Contact Plating: Gold
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: Not Available
Housing Colour: Black
Housing Material: Liquid Crystal Polymer (LCP)
Insulation Resistance: 1 GOhms
Maximum Operating Temperature: + 105 C
Minimum Operating Temperature: - 40 C
Mounting Angle: Right Angle
Number of Rows: 2 Row
Product: Headers
Row Spacing: 3 mm (0.118 in)
Subcategory: Power Connectors
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Attributes selected: 0

Datasheet

Minitek® Pwr Hybrid 3.0 Connectors

Amphenol FCI Minitek® Pwr Hybrid 3.0 Connectors are designed for power and signal applications with current ratings of up to 5A per circuit. These connectors are available for dual row and 2 to 24 power circuits, and 2 to 12 signal for wire-to-board applications. The receptacle housings allow wire-to-board configurations, and the board-mounted vertical headers support wire-to-board interconnections. Crimp, snap-in receptacle contacts are used to terminate 30AWG to 16AWG wires, and wave soldering headers are available with through-hole configurations. The 3.0 series is backward mateable with traditional 3mm power connectors if the signal pin is absent. Applications for Amphenol FCI Minitek® Pwr Hybrid 3.0 Connectors include communications, data, consumer, industrial, and instrumentation.

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